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Prior Projects
Manufacturing Processes:
Coaxial vias for tight pitch TGVs
Standard Au and Ag via filling fired in the air
Standard Cu via filling in N2
Via filling of alumina substrates
Thick Film RDL designs on glass, FS, or alumina
Coax via Concept Model
Technological Partnerships:
Partnerships with laser fab houses
Driller and filler vendors
IMAPS Committee, San Diego Chapter
Histamine Sensor
Testing and Assessments:
30 GHz measurements of glass substrate circuits
Mechanical and environmental screening protocols
Component quality and reliability assessments
Biomedical device assembly
Array of Coax Vias
-100 dB crosstalk between vias
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